Welcome to the BondTest project
Diffusion Bonding is a solid state joining process and is achieved by the atomic diffusion at the joint interface without any significant deformation of the components. The result is a very clean homogenous joint. There is currently no NDT technique that can reliably detect defects of the required dimensions and size in diffusion bonded joints during manufacture or in-service. The BondTest project will develop a validated NDT technique and system that will meet appropriate detection criteria, which will be commercialised and made available to industry.