WP2 Technical Meeting -September 2014A Technical Meeting in work package 2 took place at TWI's facilites in Camridge between I-Deal Technologies and TWI. The array controller with software optimised for BondTest was successfully delivered and installed. Initail training was also delivered. The I-Deal Technologies Phased Array Ultrasonic Testing system with hardware and software for diffusion bond testing after the installation at TWI's facilities in Cambridge, UK. The initial probe holder provided with the system. A new BondTest assembly has later been designed and manufactured.