WP2 Technical Meeting -September 2014

A Technical Meeting in work package 2 took place at TWI's facilites in Camridge between I-Deal Technologies and TWI. The array controller with software optimised for BondTest was successfully delivered and installed. Initail training was also delivered.

I-Deal PAUT system
The I-Deal Technologies Phased Array Ultrasonic Testing system with hardware and software for diffusion bond testing after the installation at TWI's facilities in Cambridge, UK.
I-Deal PAUT system close-up
The initial probe holder provided with the system. A new BondTest assembly has later been designed and manufactured.